Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 34, Issue 2, Pages 335-343Publisher
JOURNAL MATER SCI TECHNOL
DOI: 10.1016/j.jmst.2017.07.020
Keywords
Al-4wt%Cu alloy; Electric field; Quenched-in vacancy; Vacancy migration enthalpy; Solute clustering
Funding
- Major State Basic Research Projections of China [2012CB619506]
- National Natural Science Foundations of China [51071177, 11475130, 11575131, 51474244]
- Ministry of Education of China (Collaborative Innovation Center of Advanced Nonferrous Structural Materials and Manufacturing)
Ask authors/readers for more resources
The effects of electric field on the evolution of excess quenched-in vacancy as well as solute clustering in Al-4wt%Cu alloy, and on the vacancy migration and formation enthalpy of pure aluminum were investigated, using positron annihilation lifetime spectroscopy, high-angle annular dark-field scanning transmission electron microscopy, transmission electron microscopy, hardness measurement and four-probe electrical resistivity measurement. The results showed that the electric field improved age hardening response obviously and postponed the decay of excess vacancies for 30 min during the early stage ageing of Al-4wt%Cu alloy. A large number of 2-4 nm GP zones with dense distribution were observed after 1 min ageing with an electric field applied. The electric field-assisted-aged sample owned a lower coarsening rate of GP zone, which was about three fifths of that in the aged sample without an electric field, from 1 min to 120 min ageing. The electric field contributed 8% increase of the vacancy migration enthalpy (0.663 +/- 0.021 eV) of pure Al, comparing with that (0.611 +/- 0.023 eV) of pure Al without an electric field. The increase of vacancy migration enthalpy, induced by the electric field, was responsible for the difference on evolution of quenched-in vacancy, rapid solute clustering and age hardening improvement during the early stage ageing of Al-4wt%Cu alloy. (C) 2017 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available