Preparation and properties of heat and ultraviolet-induced bonding and debonding epoxy/epoxy acrylate adhesives

Light-Induced Bonding and Debonding with Supramolecular Adhesives

(2014) Christian Heinzmann et al.   ACS Applied Materials & Interfaces

Identification of the epoxy curing mechanism under isothermal conditions by thermal analysis and infrared spectroscopy

(2014) Hideki Yamasaki et al.   JOURNAL OF MOLECULAR STRUCTURE

Reversible adhesion between a hydrogel and a polymer brush

(2012) Guillaume Sudre et al.   Soft Matter

Novel silicone aliphatic amine curing agent for epoxy resin: 1,3-Bis(2-aminoethylaminomethyl) tetramethyldisiloxane. 1. Non-isothermal cure and thermal decomposition property

(2012) Cheng Li et al.   THERMOCHIMICA ACTA

Rapid Bonding/Debonding on Demand: Reversibly Cross-Linked Functional Polymers via Diels−Alder Chemistry

(2010) Andrew J. Inglis et al.   MACROMOLECULES

A Gecko-Inspired Reversible Adhesive

(2008) Michael T. Northen et al.   ADVANCED MATERIALS

UV/heat dual-curable adhesive tapes for fabricating stacked packages of semiconductors

(2008) Naoya Saiki et al.   JOURNAL OF APPLIED POLYMER SCIENCE