Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method

Published 2018 View Full Article

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Title
Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method
Authors
Keywords
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Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 57, Issue 6S1, Pages 06HJ12
Publisher
Japan Society of Applied Physics
Online
2018-05-24
DOI
10.7567/jjap.57.06hj12

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