Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter

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Title
Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter
Authors
Keywords
Round pin-fin, Heat Sink, Phase change material, Thermal conductivity enhancers, Paraffin wax, Set point temperatures, Enhancement ratio, Heat capacity, Thermal conductance
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 117, Issue -, Pages 861-872
Publisher
Elsevier BV
Online
2017-10-24
DOI
10.1016/j.ijheatmasstransfer.2017.10.008

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