Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity

Title
Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity
Authors
Keywords
Polyimide films, Boron nitride, Mesoscopic simulation, Thermal conductivity
Journal
CHINESE JOURNAL OF POLYMER SCIENCE
Volume -, Issue -, Pages -
Publisher
Springer Nature
Online
2018-06-18
DOI
10.1007/s10118-018-2155-2

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