Enhanced copper adsorption by DTPA-chitosan/alginate composite beads: Mechanism and application in simulated electroplating wastewater

Published 2018 View Full Article

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Title
Enhanced copper adsorption by DTPA-chitosan/alginate composite beads: Mechanism and application in simulated electroplating wastewater
Authors
Keywords
-
Journal
CHEMICAL ENGINEERING JOURNAL
Volume 339, Issue -, Pages 322-333
Publisher
Elsevier BV
Online
2018-02-02
DOI
10.1016/j.cej.2018.01.071

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