Room-Temperature Triple-Ligand Surface Engineering Synergistically Boosts Ink Stability, Recombination Dynamics, and Charge Injection toward EQE-11.6% Perovskite QLEDs
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Title
Room-Temperature Triple-Ligand Surface Engineering Synergistically Boosts Ink Stability, Recombination Dynamics, and Charge Injection toward EQE-11.6% Perovskite QLEDs
Authors
Keywords
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Journal
ADVANCED MATERIALS
Volume -, Issue -, Pages 1800764
Publisher
Wiley
Online
2018-06-11
DOI
10.1002/adma.201800764
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