Point defects at the Σ5(012)[100] grain boundary in TiN and the early stages of Cu diffusion: An ab initio study

Title
Point defects at the Σ5(012)[100] grain boundary in TiN and the early stages of Cu diffusion: An ab initio study
Authors
Keywords
Titanium nitride, Grain boundary, Defects, Diffusion, Copper
Journal
ACTA MATERIALIA
Volume 144, Issue -, Pages 496-504
Publisher
Elsevier BV
Online
2017-11-06
DOI
10.1016/j.actamat.2017.11.005

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