Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Published 2018 View Full Article

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Title
Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process
Authors
Keywords
-
Journal
ACS Nano
Volume 12, Issue 5, Pages 4164-4171
Publisher
American Chemical Society (ACS)
Online
2018-04-12
DOI
10.1021/acsnano.8b00180

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