Article
Engineering, Electrical & Electronic
Sanghuck Jeon, Jiah Hong, Seokjun Hong, Chaitanya Kanade, Kihong Park, Hyunho Seok, Hojoong Kim, Sunyoung Lee, Taesung Kim
Summary: The addition of poly(ethylene glycol) (PEG) to poly(diallyldimethylammonium chloride) (PDADMAC) solutions inhibits adsorption of PDADMAC on polysilicon films, suppressing polysilicon static etching and removal amounts while improving surface roughness. Adsorption mechanism of PEG on polysilicon films and its inhibitory effect on PDADMAC during CMP process were investigated.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2021)
Article
Engineering, Mechanical
Seungchul Hong, Deoksu Han, Keon-Soo Jang
Summary: The study focused on improving the planarization performance of dielectric layers by adjusting the zeta potential of particles and using surfactants, achieving a balance between performance and wafer defect density. High-quality wafer surfaces with rare defects, low roughness, and no contamination were achieved by tailoring the surface potential of colloidal silica nanoparticles and reducing defect concentration using fluorinated surfactant-induced intermolecular repulsion.
Article
Materials Science, Multidisciplinary
Wang Ye, Baoguo Zhang, Pengfei Wu, Liu Min, Dexing Cui, Wenhao Xian
Summary: This study investigates the use of wet ball milling and chemical agents to improve the dispersion stability of CeO2 slurry. Different organic acids were used as adjusting agents, and it was found that the CeO2 suspensions using acetic acid showed good stability, monodispersity, and higher chemical activity. Additionally, the CeO2 slurry using acetic acid as the adjusting agent exhibited a higher removal rate in CMP experiments.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2023)
Article
Chemistry, Physical
Kiho Bae, Kangchun Lee
Summary: The poor removal rate of ultra-fine nanoparticles as an abrasive in shallow trench isolation (STI) chemical mechanical planarization (CMP) is limited by the physicochemical interaction between the abrasive and conventional passivation agent. In this study, a nonionic polymer polyvinyl alcohol (PVA) was proposed as a novel passivation agent to restrict the hydrolysis reaction of Si3N4 film. The selective adsorption of PVA onto the Si3N4 film lowers its removal rate by suppressing the hydrolysis reaction, while the removal rate of SiO2 film remains constant.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
(2024)
Article
Computer Science, Artificial Intelligence
Sinyoung Kim, Jaeyeon Jang, Chang Ouk Kim
Summary: In semiconductor manufacturing, achieving high processing quality for CMP is difficult due to process variations such as drift and shift. The proposed controller based on LSGAN aims to capture input distributions to improve control accuracy and computation time. By utilizing a generator and a discriminator, the model generates fake input distributions that are indistinguishable from real distributions through competition in a deep-learning framework.
JOURNAL OF INTELLIGENT MANUFACTURING
(2021)
Article
Automation & Control Systems
WenQing Xiong, Jie Li, Yan Qiao, LiPing Bai, BaoYing Huang, NaiQi Wu
Summary: Nowadays, cluster tools are extensively used in wafer manufacturing processes. With the development of equipment design, multifunctional process modules (MPMs) are equipped to serve for processing multiple operations together. An efficient scheduling method is desired to quickly adapt to wafer processing parameter changes and maximize productivity. A deadlock-free Petri net (PN) model is developed and two algorithms are proposed to calculate the makespan. An adaptive scheduling method is presented to minimize the makespan by setting the functions of MPMs. Experimental results show the efficiency and effectiveness of the proposed method.
IEEE TRANSACTIONS ON SYSTEMS MAN CYBERNETICS-SYSTEMS
(2023)
Article
Materials Science, Multidisciplinary
Huiping Ma, Jianwei Zhou, Chenwei Wang, Yue Zhang, Zihao Li, Xinying Zhang, Guangyao Liu
Summary: As technology advances, ruthenium (Ru) is considered as the ideal barrier material for copper interconnects in the next generation of integrated circuits. This paper introduces DTPA-5K as a complexing agent to increase the removal rate of Ru during chemical mechanical polishing (CMP) and demonstrates its effectiveness through various experimental approaches.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2022)
Article
Engineering, Multidisciplinary
Haoshu Cai, Jianshe Feng, Feng Zhu, Qibo Yang, Xiang Li, Jay Lee
Summary: A novel method named JIT-PF model is proposed to dynamically predict MRR in CMP process by using a Just-in-time (JIT) model-based strategy. The method applies a reference search procedure, Support Vector Regression model, and Particle Filter to track process changes and continuously learn for enhanced accuracy. The JIT-PF model outperforms other peer dynamic models and some static models in the literature.
Review
Engineering, Civil
Shoufa Liu, Geethapriyan Thangamani, Muthuramalingam Thangaraj, Panagiotis Karmiris-Obratanski
Summary: Many newer higher strength materials are being synthesized for various applications and it is important to utilize unconventional machining process due to the difficulty in cutting such materials using conventional methods. This study analyzed the influence of process parameters, electrodes, optimization, and electrolytes on performance measures in Electrochemical Machining process. The effects of pulse related parameters on electrode and coating materials, as well as their thickness, were investigated under different perspectives. More research is needed to find suitable electrolytes and their combinations, and adopting different optimization algorithms can improve the performance of the machining process.
ARCHIVES OF CIVIL AND MECHANICAL ENGINEERING
(2023)
Article
Chemistry, Multidisciplinary
Seho Sun, Kangchun Lee, Ganggyu Lee, Yehwan Kim, Sungmin Kim, Junha Hwang, Hyungoo Kong, Kyung Yoon Chung, Ghulam Ali, Taeseup Song, Ungyu Paik
Summary: This article introduces an Fe-substituted SiO2 material that improves colloidal stability in low-defect tungsten CMP applications by controlling the dissolution-reprecipitation replacement process of Fe and Si ions in the lattice, thereby enhancing the performance of W CMP.
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
(2022)
Article
Chemistry, Multidisciplinary
Mumtahina Mahajabin Adrita, Alexander Brem, Dominic O'Sullivan, Eoin Allen, Ken Bruton
Summary: The manufacturing industry is continually seeking opportunities for automation, eliminating manual processes through digitized data analysis to reduce errors and increase efficiency.
APPLIED SCIENCES-BASEL
(2021)
Article
Polymer Science
Ioan Tamasag, Irina Besliu-Bancescu, Traian-Lucian Severin, Constantin Dulucheanu, Delia-Aurora Cerlinca
Summary: This study aims to investigate the influence of printing direction, thickness of deposited material layer, and temperature of previously deposited material layer on the mechanical characteristics and surface finish of additively manufactured parts. The results demonstrate the possibility of a sustainable and cost-effective manufacturing process. Printing direction has negligible impact on hardness, whereas nozzle diameter significantly affects hardness. ANOVA analysis reveals that nozzle diameter is a statistically significant factor for hardness, while printing direction is significant for tensile strength.
Article
Polymer Science
Jack Grubbs, Bryer C. Sousa, Danielle L. Cote
Summary: This study aims to establish a multi-step optimization methodology for FFF technology, using PLA as a case study, in order to make FFF more applicable across different material types. The results showed that different materials require different optimal print conditions, where part dimensions and tensile properties varied depending on the combination of various parameters. By implementing the filament-specific optimization framework established in this study, more efficient processing of new materials will be possible for enhanced applicability of FFF in the 3DP field.
Article
Engineering, Chemical
You-Sheng Lin, Kuen-Song Lin, Wei-Chin Tsai, Ndumiso Vukile Mdlovu, Cheng-Yan Tang, U-Ser Jeng
Summary: In this study, cubic CeO2 nanoparticles with uniform structure were synthesized using cetyltrimethylammonium bromide (CTAB) as a cationic surfactant, and these nanoparticles were used for silica wafer polishing. The results showed that the CTABx-CeO2 NPs reduced the roughness of the raw material by 70.7-74.5%.
JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS
(2023)
Article
Chemistry, Physical
Donggeon Kwak, Seungjun Oh, Juhwan Kim, Junho Yun, Taesung Kim
Summary: The study investigated the impact of ceria concentration on the removal rate of silicon oxide during chemical mechanical planarization. Results showed that the removal rate decreased with increasing abrasive concentration, while a wide adsorption layer was formed on the wafer surface with ceria abrasive. Understanding the adsorption between ceria and silicon oxide will aid in further research on post CMP cleaning processes and CMP processes.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
(2021)
Article
Materials Science, Ceramics
Junghyun Choi, Patrick Joo Hyun Kim, Jihoon Seo, Jiseok Kwon, Sangkyu Lee, Taeseup Song
CERAMICS INTERNATIONAL
(2018)
Article
Materials Science, Multidisciplinary
Jihoon Seo, Akshay Gowda, S. V. Babu
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2018)
Article
Materials Science, Multidisciplinary
C. K. Ranaweera, N. K. Baradanahalli, R. Popuri, J. Seo, S. V. Babu
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2018)
Article
Materials Science, Multidisciplinary
Jihoon Seo, S. S. R. K. Hanup Vegi, C. K. Ranaweera, N. K. Baradanahalli, Ja-Hyung Han, Dinesh Koli, S. V. Babu
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2018)
Article
Materials Science, Multidisciplinary
Jihoon Seo, Akshay Gowda, Panart Khajornrungruang, Satomi Hamada, Taeseup Song, Suryadevara Babu
JOURNAL OF MATERIALS RESEARCH
(2020)
Review
Materials Science, Multidisciplinary
Jihoon Seo
Summary: This review paper provides a comprehensive overview of various chemical and mechanical phenomena involved in CMP technology, discussing the complex interactions occurring during polishing and offering insights into new strategies and concepts for next-generation CMP slurries. It highlights the challenges and future research directions related to the chemical and mechanical process and slurry chemistry.
JOURNAL OF MATERIALS RESEARCH
(2021)
Article
Materials Science, Multidisciplinary
Jihoon Seo, Akshay Gowda, Panart Khajornrungruang, Satomi Hamada, S. V. Babu
Summary: This study extends the 2D trajectory and diffusion coefficient data of ceria particles near a glass surface to 3D, revealing different motion behaviors of the particles at different pH values. Additionally, the cleaning effectiveness of DI water adjusted to different pH levels on glass surfaces contaminated with ceria particles was evaluated based on trajectory, diffusion coefficient, and interaction potential data.
JOURNAL OF MATERIALS RESEARCH
(2021)
Article
Materials Science, Multidisciplinary
C. K. Ranaweera, P. Khajornrungruang, S. Hamada, A. Gowda, H. Vegi, J. Seo, S. Babu
Summary: The study on brush cleaning process showed that direct contact is crucial for particle removal, while redeposition can impact the cleaning efficiency. Using high alkaline NH4OH solution was more effective in removing ceria particles compared to DI water.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Materials Science, Multidisciplinary
Jihoon Seo, Ali Othman, Hong Jin Kim, Jainendra Devabhaktuni, Rahul Trivedi, Dinesh Penigalapati, Thayalan Kulasingam, S. S. R. K. Hanup Vegi, S. V. Babu
Summary: Temperature affects the health parameters of ceria-based slurry, with most parameters being reversible except for dissolved oxygen concentration. Higher storage temperatures lead to higher dissolved oxygen concentrations, resulting in lower SiO2 removal rates.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Chemistry, Multidisciplinary
Kangchun Lee, Jihoon Seo
Summary: A novel strategy involving the formation of coordination complex between picolinic acid and tungsten oxide suppresses tungsten dissolution and improves tungsten topography. Addition of 1.5 wt% picolinic acid as an inhibitor dramatically attenuates the dissolution rate of tungsten, leading to improved topography with an R-a value of 7.8 nm while validating CMP removal rate.
APPLIED SCIENCES-BASEL
(2022)
Article
Materials Science, Multidisciplinary
Charith K. Ranaweera, S. Babu, Satomi Hamada, Jihoon Seo
Summary: This study measured the force required to clean ceria particles from surfaces using brush scrubbing, and investigated the influence of the additive proline on the cleaning process. The results showed that the adhesion of ceria particles on polished surfaces was twice as strong as that on contaminated surfaces. Ceria particles modified with proline were the most difficult to remove. Furthermore, brushing with deionized water significantly reduced the adhesion force of residual particles.
JOURNAL OF MATERIALS RESEARCH
(2022)
Article
Materials Science, Multidisciplinary
Jihoon Seo, Kijung Kim, Hyungoo Kang, S. V. Babu
Summary: This paper discusses the usage of ceria particles in chemical mechanical planarization (CMP) technology and provides perspectives on improving the performance metrics of current ceria abrasives and ceria-based CMP slurries.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2022)
Article
Materials Science, Multidisciplinary
Akshay Gowda, Jihoon Seo, Charith K. Ranaweera, S. Babu
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2020)
Article
Materials Science, Multidisciplinary
Jihoon Seo, S. S. R. K. Hanup Vegi, S. V. Babu
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2019)
Article
Materials Science, Multidisciplinary
Junghyun Choi, Patrick Joo Hyun Kim, Jihoon Seo, Jiseok Kwon, Sangkyu Lee, Taeseup Song
ADVANCED ENGINEERING MATERIALS
(2018)