4.5 Article

Effect on Friction Reduction of Micro/Nano Hierarchical Patterns on Sapphire Wafers

Publisher

KOREAN SOC PRECISION ENG
DOI: 10.1007/s40684-017-0004-3

Keywords

Friction reduction; Micro/Nano hierarchical pattern; Coefficient of friction (COF); Stribeck curve; Laser machining; Abrasive air jet

Funding

  1. Development of ICT-based smart machine tools and flexible automation systems of the Ministry of Trade, Industry and Energy (MOTIE), Korea [10060188]
  2. Development of Core Technologies for High-Reliability Vertical Machining Centers of the Ministry of Trade, Industry and Energy(MOTIE), Korea [10063361]
  3. Korea Evaluation Institute of Industrial Technology (KEIT) [10063361, 10060188] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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As well as the micro patterns, many functional surfaces exhibit micro/nano hierarchical patterns. Micro- and nano-patterned surfaces can be fabricated using various techniques including photolithography, electron-beams, and so on. However, these processes were developed for semiconductor fabrication and are not convenient for large-area applications. In this paper, we describe a manufacturing process for micro/nano hierarchical patterns using a laser and an abrasive air jet, whereby the laser is used to manufacture microscale patterns, and an abrasive air jet is applied to the micro-patterned surface to generate the nanoscale patterns. This method is a simple process that can be used to rapidly manufacture hierarchical patterns, making it suitable for large-area applications. We also developed a friction test system, which minimizes external vibrations and sample wear during the measurements. Our results showed that the coefficient of friction of the hierarchical patterns was 12% smaller than that of microscale patterns.

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