An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment

Published 2017 View Full Article

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Title
An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
Authors
Keywords
-
Journal
IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES
Volume E100.A, Issue 3, Pages 776-784
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Online
2017-03-01
DOI
10.1587/transfun.e100.a.776

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