Surface evolution and stability transition of silicon wafer subjected to nano-diamond grinding

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Mechanisms for Hydrolysis of Silicon Nanomembranes as Used in Bioresorbable Electronics

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Full-field measurement of surface topographies and thin film stresses at elevated temperatures by digital gradient sensing method

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Soft, stretchable, fully implantable miniaturized optoelectronic systems for wireless optogenetics

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Soft network composite materials with deterministic and bio-inspired designs

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Ultra-flexible Piezoelectric Devices Integrated with Heart to Harvest the Biomechanical Energy

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Fast flexible electronics with strained silicon nanomembranes

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A study on the diamond grinding of ultra-thin silicon wafers

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Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material

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Non-uniform stress distribution and deformation bifurcation of thin film/substrate system subjected to gradient temperature

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Hybrid Integrated Platforms for Silicon Photonics

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Stretchable and Foldable Silicon Integrated Circuits

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