Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide

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Title
Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide
Authors
Keywords
Waste printed circuit boards, Halogenated epoxy resin substrate, Dimethylacetamide, Liberation, Dissolution, Separation
Journal
WASTE MANAGEMENT
Volume 60, Issue -, Pages 652-659
Publisher
Elsevier BV
Online
2016-12-30
DOI
10.1016/j.wasman.2016.12.031

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