Microstructure and mechanical properties of metastable solid solution copper‑tungsten films

Published 2017 View Full Article

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Title
Microstructure and mechanical properties of metastable solid solution copper‑tungsten films
Authors
Keywords
Metastable phases, Nanocrystalline nanostructure, Nanoindentation, X-ray diffraction, Copper, Tungsten, Sputtering
Journal
THIN SOLID FILMS
Volume 642, Issue -, Pages 82-89
Publisher
Elsevier BV
Online
2017-09-08
DOI
10.1016/j.tsf.2017.09.007

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