A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

Published 2017 View Full Article

Authors

Keywords

Copper, Thin films, Supercritical fluid chemical deposition, Sputtering, Resistivity, Microstructure

Journal

THIN SOLID FILMS

Volume 643, Issue -, Pages 53-59

Publisher

Elsevier BV

Online

2017-09-05

DOI

10.1016/j.tsf.2017.09.002

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started