Corrosion-induced tin whisker growth in electronic devices: a review

Phase and structural transformations in annealed copper coatings in relation to oxide whisker growth

(2015) M.V. Dorogov et al.   APPLIED SURFACE SCIENCE

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys

(2015) Balázs Illés et al.   CORROSION SCIENCE

Efficiency of a conductive cement-based anodic system for the application of cathodic protection, cathodic prevention and electrochemical chloride extraction to control corrosion in reinforced concrete structures

(2015) J. Carmona et al.   CORROSION SCIENCE

Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review

(2015) Peigen Zhang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Tin whisker growth from micro-alloyed SAC solders in corrosive climate

(2014) Balázs Illés et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates

(2014) Seong-Hun Na et al.   METALS AND MATERIALS INTERNATIONAL

Corrosion properties of tin–copper alloy coatings in aspect of tin whisker growth

(2013) Barbara Horváth et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Copper-oxide whisker growth on tin–copper alloy coatings caused by the corrosion of Cu6Sn5 intermetallics

(2013) Barbara Horváth et al.   JOURNAL OF MATERIALS SCIENCE

Least lead addition to mitigate tin whisker for ambient storage

(2013) Jung-Lae Jo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation

(2013) Wahyu Diyatmika et al.   THIN SOLID FILMS

The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

(2012) Cai-Fu Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0Ag–0.5Cu solder doping with In and Zn in NaCl solution

(2011) L. Hua et al.   MICROELECTRONICS RELIABILITY

Effects of humidity on tin whisker growth — Investigated on Ni and Ag underplated layer construction

(2011) Barbara Horváth et al.   THIN SOLID FILMS

The effect of electric current and surface oxidization on the growth of Sn whiskers

(2010) Kyung-Seob Kim et al.   APPLIED SURFACE SCIENCE

Tin Whisker Test Development—Temperature and Humidity Effects Part II: Acceleration Model Development

(2010) John W. Osenbach et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

(2010) H.L. Reynolds et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress

(2010) Agata Skwarek et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Effect of strongly oxidizing environment on whisker growth form tin coating

(2010) Balázs Illés et al.   SURFACE & COATINGS TECHNOLOGY

Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress

(2009) A. Skwarek et al.   APPLIED SURFACE SCIENCE

The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment

(2008) Albert T. Wu et al.   MICROELECTRONICS RELIABILITY