Journal
SENSORS
Volume 17, Issue 11, Pages -Publisher
MDPI AG
DOI: 10.3390/s17112451
Keywords
3-axis tactile sensor; MEMS-CMOS integration; capacitive sensor; Au-Au thermo-compression bonding; low temperature cofired ceramic
Funding
- Special Coordination Funds for Promoting Science and Technology
- VLSI Design and Education Center (VDEC), University of Tokyo
- Synopsys, Inc.
- Cadence Design Systems, Inc.
- Mentor Graphics, Inc.
- JSPS [16J01558]
- Grants-in-Aid for Scientific Research [16J01558] Funding Source: KAKEN
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This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au through vias by Au-Au thermo-compression bonding. The CMOS circuit and bonding pads on the sensor backside were electrically connected through Au bumps and the LTCC interposer, and the differential capacitive gap was formed by an Au sealing frame. A diaphragm for sensing 3-axis force was formed in the CMOS substrate. The dimensions of the completed sensor are 2.5 mm in width, 2.5 mm in length, and 0.66 mm in thickness. The fabricated sensor output coded 3-axis capacitive sensing data according to applied 3-axis force by three-dimensional (3D)-printed pins. The measured sensitivity was as high as over 34 Count/mN for normal force and 14 to 15 Count/mN for shear force with small noise, which corresponds to less than 1 mN. The hysteresis and the average cross-sensitivity were also found to be less than 2% full scale and 11%, respectively.
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