Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon

Published 2017 View Full Article

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Title
Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon
Authors
Keywords
Fixed abrasive, Diamond wire, Precision slicing, Single-crystal silicon, Dicing wire saw, Ductile mode machining, Subsurface damage, Surface integrity
Journal
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume 50, Issue -, Pages 32-43
Publisher
Elsevier BV
Online
2017-04-23
DOI
10.1016/j.precisioneng.2017.04.011

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