Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb

Published 2017 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb
Authors
Keywords
-
Journal
OPTICS EXPRESS
Volume 25, Issue 11, Pages 12689
Publisher
The Optical Society
Online
2017-05-23
DOI
10.1364/oe.25.012689

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.