High throughput soft embossing process for micro-patterning of PEDOT thin films

Title
High throughput soft embossing process for micro-patterning of PEDOT thin films
Authors
Keywords
Micro-patterning, PEDOT, Soft embossing, Ethylene glycol, Conductivity, Soft electrodes
Journal
MICROELECTRONIC ENGINEERING
Volume 176, Issue -, Pages 15-21
Publisher
Elsevier BV
Online
2017-01-15
DOI
10.1016/j.mee.2017.01.011

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