Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw

Title
Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw
Authors
Keywords
Single-crystal silicon carbide, Wire saw, Sawing force, Material removal mode
Journal
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 63, Issue -, Pages 25-32
Publisher
Elsevier BV
Online
2017-01-28
DOI
10.1016/j.mssp.2017.01.014

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