Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application

Here we report the effect of microwave treatment on a silica-carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy-SiO2 /C composite was improved by 178% at 40wt % content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6 degrees C in glass transition temperature of the epoxy-SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.