Photo and Thermal Cured Silicon-Containing Diethynylbenzene Fibers via Melt Electrospinning with Enhanced Thermal Stability
Published 2017 View Full Article
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Title
Photo and Thermal Cured Silicon-Containing Diethynylbenzene Fibers via Melt Electrospinning with Enhanced Thermal Stability
Authors
Keywords
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Journal
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
Volume 55, Issue 17, Pages 2815-2823
Publisher
Wiley
Online
2017-07-19
DOI
10.1002/pola.28687
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