Dissimilar copper-aluminum joint processed by low-temperature nickel electroplating

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Title
Dissimilar copper-aluminum joint processed by low-temperature nickel electroplating
Authors
Keywords
Low-temperature joining, Nickel electroplating, Copper, Aluminum, Interface, TEM, IMC
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 242, Issue -, Pages 68-76
Publisher
Elsevier BV
Online
2016-11-23
DOI
10.1016/j.jmatprotec.2016.11.025

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