The role of copper nanoparticles in an etch-and-rinse adhesive on antimicrobial activity, mechanical properties and the durability of resin-dentine interfaces
The role of copper nanoparticles in an etch-and-rinse adhesive on antimicrobial activity, mechanical properties and the durability of resin-dentine interfaces
Authors
Keywords
Adhesive system, Copper nanoparticles, Antimicrobial activity, Knoop microhardness, Degree of conversion, Resin-dentine bond strength, Nanoleakage
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