Thermomechanical and electroactive behavior of a thermosetting styrene-based carbon black shape-memory composite

A thermosetting styrene-based shape memory polymer (SMP) filled with nanoscale (30 nm) carbon black are prepared to reinforce the thermomechanical performances and realize the high-efficient electronic actuation at macro scale due to the carbon-carbon network morphology at nano/micro scale. The elastic modulus of this thermosetting SMP composite is significant strengthened and can maintain at 1-2.5 GPa at around the room temperature, which is suitable for used as a structural material. The electronic resistivity decreases sharply at a quite low percolation threshold range (2-5%), and maintains at a relatively low and stable level of electronic resistivity. Furthermore, the electronic resistivity also exhibits relative stability in terms of the resistivity-temperature-time relationship and the evolution of resistivity upon heating-cooling cycles. This shape memory styrene-based composite is suitable to be used as an electroactive functional material in realistic engineering. (c) 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 45978.