Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 693, Issue -, Pages 426-431Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2016.09.228
Keywords
Continuous dynamic recrystallization (CDRX); Electron backscattered diffraction (EBSD); Grain orientation spread (GOS); NiTi shape memory alloy (NiTiNOL); Hot deformation
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Funding
- National Natural Science Foundation of China [51201016]
- Industrial Strategic Technology Development Program of Ministry of Trade, Industry and Energy, Republic of Korea [10042703]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10042703] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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The mechanisms of dynamic recrystallization (DRX) in a 50Ti-47Ni-3Fe alloy are studied using compression tests at temperatures of 1023-1323 K with strain rates of 0.01-10 s(-1), and the resulting stress-strain curves are used to construct an Arrhenius equation with a Zener-Hollomon parameter (Z). The relationship between this Z parameter and stress, and its effect on the subgrain size are discussed. With the help of electron backscatter diffraction (EBSD), the development of recrystallizing grain boundaries is tracked in deformed grains with different grain orientation spread (GOS) values. Continuous dynamic recrystallization (CDRX) is subsequently confirmed by evidence of the conversion of low-angle boundaries (LAGBs) into high-angle boundaries (HAGBs). Grain boundary sliding (GBS) and HAGB migration are therefore considered secondary mechanisms under high-Z (ln Z > 29) and low-Z (ln Z < 23.5) conditions, but CDRX is confirmed as the dominant DRX mechanism. (C) 2016 Elsevier B.V. All rights reserved.
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