Journal
JOM
Volume 69, Issue 9, Pages 1696-1700Publisher
SPRINGER
DOI: 10.1007/s11837-017-2469-5
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Funding
- National Natural Science Foundation of China [51601227]
- National Key R&D Program of China [2016YFB0301301]
- China postdoctoral Science Foundation [161881]
- project of innovation-driven plan of State Key Laboratory of Powder Metallurgy, Central South University, Changsha, China
- State Key Laboratory of Powder Metallurgy, Central South University, Changsha, China
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In this article, the microstructure evolution and the formation of void defects in continuous extruded Cu-Mg alloy were investigated. The results showed that hot deformation, grain rearrangement, grain rotation, and grain boundary sliding occurred in the right-angle bending zone and extending extrusion zone. Voids formed in the extending deformation zone and grew up in the extrusion deformation core. The uncoordinated reaction of the grain boundary and dislocation blocked grain boundary slide in the triple grain boundary junctions, leading to nucleation of voids. Severe deformation and grain rearrangement resulted in the expansion of voids consequently through with the grain boundary slide.
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