Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

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Title
Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
Authors
Keywords
Intergranular fatigue fracture, Lead-free solder, Crystal plasticity, Cohesive zone, Finite element modeling
Journal
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
Volume 106-107, Issue -, Pages 1-12
Publisher
Elsevier BV
Online
2016-12-07
DOI
10.1016/j.ijsolstr.2016.12.003

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