In situ frustum indentation of nanoporous copper thin films

Authors

Keywords

Physical phenomena: yield condition, Problem description: constitutive behavior, Problem description: porous material, Methods: finite elements, Methods: mechanical testing, Methods: electron microscopy

Journal

INTERNATIONAL JOURNAL OF PLASTICITY

Volume 98, Issue -, Pages 139-155

Publisher

Elsevier BV

Online

2017-07-25

DOI

10.1016/j.ijplas.2017.07.005

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