Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear

Published 2017 View Full Article

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Title
Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear
Authors
Keywords
Stacking fault tetrahedron, Twin boundary, Dislocation, Atomic diffusion
Journal
INTERNATIONAL JOURNAL OF PLASTICITY
Volume 97, Issue -, Pages 246-258
Publisher
Elsevier BV
Online
2017-06-22
DOI
10.1016/j.ijplas.2017.06.005

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