Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor chip due to jet impingement

Published 2017 View Full Article

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Title
Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor chip due to jet impingement
Authors
Keywords
Jet impingement cooling, Thermal management, Thermal conduction, Convection, Analytical methods
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 110, Issue -, Pages 768-777
Publisher
Elsevier BV
Online
2017-03-30
DOI
10.1016/j.ijheatmasstransfer.2017.03.064

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