Corrosion Behavior and Metallization of Cu-Based Electrodes Using MoNi Alloy and Multilayer Structure for Back-Channel-Etched Oxide Thin-Film Transistor Circuit Integration

Published 2017 View Full Article

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Journal

IEEE TRANSACTIONS ON ELECTRON DEVICES

Volume 64, Issue 2, Pages 447-454

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Online

2017-01-10

DOI

10.1109/ted.2016.2642206

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