Nondestructive Evaluation Using a High-TcSQUID Microscope

Title
Nondestructive Evaluation Using a High-TcSQUID Microscope
Authors
Keywords
-
Journal
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2016-11-22
DOI
10.1109/tasc.2016.2631419

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started