Modeling and Analysis of the Thermal Properties Exhibited by Cyberphysical Data Centers

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Title
Modeling and Analysis of the Thermal Properties Exhibited by Cyberphysical Data Centers
Authors
Keywords
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Journal
IEEE Systems Journal
Volume 11, Issue 1, Pages 163-172
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2015-12-23
DOI
10.1109/jsyst.2015.2493565

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