Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
Authors
Keywords
Ultrasonic-assisted bonding, Die bonding, Tin-nickel compounds, Power electronics, Interconnections, Aging
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