Organothiol-Based Hybrid-Layer Strategy for High-Performance Copper Adhesion and Stress-Migration via Simultaneous Oxide Reduction

Controlling kinetics of heterogeneous sol–gel solution for high-performance adhesive hybrid films

(2015) Qiran Xiao et al.   JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY

Electrochemical Assembly of Thiol-based Monolayer on Copper for Epoxy-Cu Adhesion Improvement

(2014) Stephen C.T. Kwok et al.   ELECTROCHIMICA ACTA

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

(2012) Wenjing Zhang et al.   MICROELECTRONICS RELIABILITY

Stress control during thermal annealing of copper interconnects

(2011) C.-C. Yang et al.   APPLIED PHYSICS LETTERS

The effect of stress migration on electromigration in dual damascene copper interconnects

(2011) A. Heryanto et al.   JOURNAL OF APPLIED PHYSICS

Bottom-Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2-Derived Self-Assembled Monolayers

(2010) Arantxa Maestre Caro et al.   ADVANCED FUNCTIONAL MATERIALS

Effect of organic chelates on the performance of hybrid sol–gel coated AA 2024-T3 aluminium alloys

(2009) P.C. Rajath Varma et al.   PROGRESS IN ORGANIC COATINGS

Stress relaxation during isothermal annealing in electroplated Cu films

(2008) Soo-Jung Hwang et al.   THIN SOLID FILMS

Nanoscale investigation of long-term native oxidation of Cu films

(2008) Jae-Won Lim et al.   THIN SOLID FILMS