Article
Engineering, Electrical & Electronic
Mustafa Mert Torunbalci, Hasan Dogan Gavcar, Ferhat Yesil, Said Emre Alper, Tayfun Akin
Summary: The paper introduces a novel and simple all-silicon wafer-level fabrication and hermetic packaging method for MEMS devices. The method achieves hermetic sealing and signal transfer without complex process steps, with a low package vacuum and high bonding strength. MEMS resonators fabricated and packaged using this method show significant enhancements in bias instability and temperature sensitivity compared to traditional technologies.
IEEE SENSORS JOURNAL
(2021)
Article
Materials Science, Multidisciplinary
Sebastian Wittmann, Stephan Pindl, Simon Sawallich, Michael Nagel, Alexander Michalski, Himadri Pandey, Ardeshir Esteki, Satender Kataria, Max C. Lemme
Summary: Wet and semidry transfer methods for graphene were evaluated for wafer scalability, handling, contamination, and electrical performance. Wet transfer showed superior yield, carbon contamination level, and electrical quality, while semidry transfer demonstrated scalability due to existing industrial tools and processes.
ADVANCED MATERIALS TECHNOLOGIES
(2023)
Article
Computer Science, Information Systems
Song Wang, Xiping Jiang, Fujun Bai, Wenwu Xiao, Xiaodong Long, Qiwei Ren, Yi Kang
Summary: In this paper, the authors propose a true process-heterogeneous stacked embedded DRAM (SeDRAM) using hybrid bonding 3D integration process, achieving high bandwidth of 34 GBps/Gbit and high energy efficiency of 0.88 pJ/bit. The SeDRAM solution can greatly alleviate the memory wall problem and improve competitiveness in near-memory computing/computing-in-memory fields.
Article
Engineering, Electrical & Electronic
Hengmao Liang, Xiao He, Bin Xiong
Summary: In this study, a novel 3D wafer-level vacuum packaging technology for MEMS is presented, which utilizes Au-Si eutectic bonding and demonstrates excellent package performances. The technology is characterized by high mechanical strength, low capacitive feed-through effect, and good long-term stability, making it suitable for various MEMS devices.
IEEE SENSORS JOURNAL
(2022)
Article
Chemistry, Analytical
Muhammad Salman Al Farisi, Takashiro Tsukamoto, Shuji Tanaka
Summary: This study demonstrates a heterogeneous integration wafer bonding technique using an electroplated aluminum bonding frame. The bonding mechanism relies on the mechanical deformation of the electroplated aluminum bonding frame through localized bonding pressure, resulting in a high-quality bonding strength.
Article
Nanoscience & Nanotechnology
Roberto Pezone, Gabriele Baglioni, Pasqualina M. Sarro, Peter G. Steeneken, Sten Vollebregt
Summary: By utilizing a transfer-free method, microphones with ultra-thin graphene membranes that exhibit excellent mechanical compliance can be produced. This method not only overcomes the limitations of traditional transfer-based methods for graphene microphone fabrication, but also shows feasibility for high-volume production.
ACS APPLIED MATERIALS & INTERFACES
(2022)
Article
Engineering, Electrical & Electronic
Mingjie Li, Wenxin Luo, Xiaojiang Liu, Gaoqiang Niu, Fei Wang
Summary: Gas sensitive nano-materials have traditionally been deposited on specific areas of a wafer using drop-casting or inkjet printing for gas sensor fabrication. However, achieving reproducibility in wafer-level patterning of sensing materials has been a challenge. In this study, a simple top-down approach using photolithography and a well-mixed photoresist-nanomaterial suspension followed by calcination was proposed for the fabrication of wafer-scale gas sensing chips. The gas sensors produced using this method showed excellent reproducibility and uniformity in sensing response to ethanol detection, making it promising for high-volume production of MEMS compatible gas sensors.
IEEE ELECTRON DEVICE LETTERS
(2022)
Article
Engineering, Electrical & Electronic
Wei Xu, Xiaoyi Wang, Xiaofang Pan, Amine Bermak, Yi-Kuen Lee, Yatao Yang
Summary: This article presents a wafer-level packaged Pirani vacuum gauge using InvenSense CMOS MEMS technology, demonstrating high performance and integration for vacuum monitoring. The Pirani vacuum gauge achieves high sensitivity and low heating power in a very fine vacuum regime.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2021)
Article
Engineering, Electrical & Electronic
Ping Guo, Hongling Meng, Lin Dan, Jianye Zhao
Summary: This article proposes a wafer-level assembled physics package for chip-scale atomic clocks (CSACs). The method, based on 3-D wafer-level packaging and MEMS technologies, offers high uniformity and efficiency, resulting in reduced production cost.
IEEE SENSORS JOURNAL
(2022)
Article
Chemistry, Multidisciplinary
Haina Ci, Jingtao Chen, Hao Ma, Xiaoli Sun, Xingyu Jiang, Kaicong Liu, Jingyuan Shan, Xueyu Lian, Bei Jiang, Ruojuan Liu, Bingzhi Liu, Guiqi Yang, Wanjian Yin, Wen Zhao, Lizhen Huang, Teng Gao, Jingyu Sun, Zhongfan Liu
Summary: This study demonstrates a metal-catalyst-free growth method for quasi-suspended graphene, achieving wafer-level homogeneity by fine-tuning the growth mode. The resulting graphene film can be used for the fabrication of high-performance graphene-based field-effect transistor arrays and exhibits quasi-suspended properties.
ADVANCED MATERIALS
(2022)
Article
Chemistry, Physical
Ali Roshanghias, Jochen Bardong, Alfred Binder
Summary: This study proposes and investigates a new method for using jet printing of glass frit materials at the wafer level. The jetting parameters were optimized and the effect of jetted pitch size on bond-line thickness was assessed. The results reveal that jet printing of glass frit is a straightforward, cost-effective, and flexible approach with significant implications for hermetic packaging.
Article
Chemistry, Analytical
Mani Teja Bodduluri, Bjoern Gojdka, Niklas Wolff, Lorenz Kienle, Thomas Lisec, Fabian Lofink
Summary: This paper introduces a new technique called PowderMEMS, which uses atomic layer deposition (ALD) to agglomerate micron-sized powders and fabricate permanent micromagnets. The magnetic, thermal stability and corrosion stability of NdFeB micromagnets prepared using PowderMEMS are systematically investigated through a series of experiments. The results demonstrate the durability of PowderMEMS micromagnets and their potential applications in various fields.
Article
Chemistry, Analytical
Yongxin Zhou, Yuandong Gu, Songsong Zhang
Summary: This paper presents a novel wafer scale thin film thickness measurement method using reflected picosecond ultrasonic waves, which is highly efficient and suitable for opaque materials. By studying AlScN thin film and related piezoelectric stacking layers, the method successfully measured the thickness and showed good agreement with SEM data.
Article
Chemistry, Analytical
Adrian J. T. Teo, King Ho Holden Li
Summary: This study demonstrates a high-aspect-ratio three-dimensionally stacked comb structure for micromirror application using wafer bonding technology. The mechanical structure is realized through deep reactive ion etching of silicon and low-temperature fusion bonding of patterned wafers. The dependency of resonant frequency on device dimensions is systematically studied to provide useful guidelines for future design and application.
Article
Engineering, Electrical & Electronic
Tsenguun Byambadorj, Xiangyu Zhao, Yutao Qin, Yogesh B. Gianchandani
Summary: In this research, a monolithically microfabricated Knudsen pump (KP) without suspended membranes was presented. These pumps offer improved mechanical robustness, wider process window, and simplified microfabrication process compared to previous designs. The experimental results matched the modeling results well, indicating the potential for monolithic integration onto complex lab-on-a-chip systems.
SENSORS AND ACTUATORS A-PHYSICAL
(2024)
