4.5 Article

Improved functionality of PEDOT:PSS thin films via graphene doping, fabricated by ultrasonic substrate vibration-assisted spray coating

Journal

SYNTHETIC METALS
Volume 222, Issue -, Pages 309-317

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.synthmet.2016.11.009

Keywords

PEDOT:PSS; Graphene; Spray coating; Solution-processing; Thin film devices

Funding

  1. Shanghai Municipal Education Commission in the framework of Oriental Scholar Program
  2. National Natural Science Foundation of China
  3. Shanghai Sailing Program
  4. Postdoctoral Research Foundation of China

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The composite thin film of graphene and PEDOT:PSS (poly(3,4-ethylenedioxythiophene) polystyrene sulfonate) is a promising candidate of hole transport layer and transparent conductive electrode materials for low-cost thin film devices. We use novel, fast, controllable and scalable ultrasonic substrate vibration-assisted spray coating (SVASC) method to fabricate high-performance graphene-PEDOT:PSS composite thin films. Graphene sheets are uniformly dispersed in aqueous PEDOT:PSS solution using sodium dodecyl sulfonate as surfactant. The fabricated graphene-PEDOT:PSS composite thin films exhibit excellent electrical and optical properties. The electrical conductivity of composite PEDOT:PSS thin films reaches 720 S/cm, which is increased about 10 times when 0.02 wt% of graphene is incorporated in the precursor solution. This remarkable enhancement is ascribed to the higher carrier mobility and carrier concentration, because graphene sheets bridge between the PEDOT:PSS rings via the strong pi-pi interaction acting as high-mobility channel. Also, the pi-pi interaction causes a reduction in the defect sites in PEDOT:PSS. Moreover, a mild drying temperature of 80 degrees C is favored, leading to better structural arrangement of graphene bridging between the polymer segments, and higher electrical conductivity. This work simplifies the solution-processing of graphene and uses a scalable casting technique, which paves the way for the commercialization of low-cost flexible electronic devices. (C) 2016 Elsevier B.V. All rights reserved.

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