Effects of adhesive thickness on the Lamb wave pitch-catch signal using bonded piezoelectric wafer transducers

Published 2016 View Full Article

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Title
Effects of adhesive thickness on the Lamb wave pitch-catch signal using bonded piezoelectric wafer transducers
Authors
Keywords
-
Journal
Smart Materials and Structures
Volume 25, Issue 8, Pages 085014
Publisher
IOP Publishing
Online
2016-07-18
DOI
10.1088/0964-1726/25/8/085014

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