Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Published 2016 View Full Article

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Title
Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
Authors
Keywords
-
Journal
SCRIPTA MATERIALIA
Volume 123, Issue -, Pages 113-117
Publisher
Elsevier BV
Online
2016-06-19
DOI
10.1016/j.scriptamat.2016.06.008

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