Effect of alloying with palladium on the electrical and mechanical properties of copper

Microstructural design of new high conductivity – high strength Cu-based alloy

(2015) S. Gorsse et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of temperature–strain-rate conditions of deformation on structure formation in commercially pure copper deformed in Bridgman anvils

(2015) D. K. Orlova et al.   PHYSICS OF METALS AND METALLOGRAPHY

Structure, strength, and electric conductivity of a Cu-Cr copper-based alloy subjected to severe plastic deformation

(2015) R. K. Islamgaliev et al.   PHYSICS OF METALS AND METALLOGRAPHY

Structure and microhardness of chromium-zirconium bronze subjected to severe plastic deformation by dynamic channel-angular pressing and rolling

(2014) G. V. Zel’dovich et al.   PHYSICS OF METALS AND METALLOGRAPHY

The kinetics of ordering in an equiatomic CuPd alloy: A resistometric study

(2013) A.Yu. Volkov et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Solid-solution copper alloys with high strength and high electrical conductivity

(2013) Kazunari Maki et al.   SCRIPTA MATERIALIA

Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

(2012) Hui Xu et al.   ACTA MATERIALIA

High strength and ductile ultrafine-grained Cu–Ag alloy through bimodal grain size, dislocation density and solute distribution

(2012) K. Sitarama Raju et al.   ACTA MATERIALIA

Changes of microstructure and electrical resistivity of ordered Cu-40Pd (at.%) alloy under severe plastic deformation

(2011) O.V. Antonova et al.   INTERMETALLICS

Deformation and dynamic recrystallization in copper at different deformation rates in Bridgman anvils

(2011) T. I. Chashchukhina et al.   PHYSICS OF METALS AND METALLOGRAPHY