Thermal boundary conductance enhancement using experimentally achievable nanostructured interfaces – analytical study combined with molecular dynamics simulation

Effect of electron-phonon coupling on thermal transport across metal-nonmetal interface —A second look

(2015) Xufei Wu et al.   EPL

Molecular Bridge Enables Anomalous Enhancement in Thermal Transport across Hard-Soft Material Interfaces

(2014) Fangyuan Sun et al.   ADVANCED MATERIALS

The importance of anharmonicity in thermal transport across solid-solid interfaces

(2014) Xufei Wu et al.   JOURNAL OF APPLIED PHYSICS

The influence of interface bonding on thermal transport through solid–liquid interfaces

(2013) Hari Harikrishna et al.   APPLIED PHYSICS LETTERS

Relationship of thermal boundary conductance to structure from an analytical model plus molecular dynamics simulations

(2013) Xiao Wang Zhou et al.   PHYSICAL REVIEW B

Effects of chemical bonding on heat transport across interfaces

(2012) Mark D. Losego et al.   NATURE MATERIALS

Enhancing and tuning phonon transport at vibrationally mismatched solid-solid interfaces

(2012) Timothy S. English et al.   PHYSICAL REVIEW B

Large “near junction” thermal resistance reduction in electronics by interface nanoengineering

(2011) Ming Hu et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Acoustic mismatch model for thermal contact resistance of van der Waals contacts

(2009) Ravi Prasher   APPLIED PHYSICS LETTERS

Effects of Self-Heating on Performance Degradation in AlGaN/GaN-Based Devices

(2009) Brahim Benbakhti et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Thermal boundary resistance predictions from molecular dynamics simulations and theoretical calculations

(2009) E. S. Landry et al.   PHYSICAL REVIEW B

Kapitza conductance of silicon–amorphous polyethylene interfaces by molecular dynamics simulations

(2009) Ming Hu et al.   PHYSICAL REVIEW B

How Wetting and Adhesion Affect Thermal Conductance of a Range of Hydrophobic to Hydrophilic Aqueous Interfaces

(2009) Natalia Shenogina et al.   PHYSICAL REVIEW LETTERS