The effect of Ag, Pb and Bi impurities on grain boundary sliding and intergranular decohesion in Copper
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Title
The effect of Ag, Pb and Bi impurities on grain boundary sliding and intergranular decohesion in Copper
Authors
Keywords
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Journal
PHILOSOPHICAL MAGAZINE
Volume 96, Issue 27, Pages 2868-2886
Publisher
Informa UK Limited
Online
2016-08-05
DOI
10.1080/14786435.2016.1217360
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