The effect of Ag, Pb and Bi impurities on grain boundary sliding and intergranular decohesion in Copper

Title
The effect of Ag, Pb and Bi impurities on grain boundary sliding and intergranular decohesion in Copper
Authors
Keywords
-
Journal
PHILOSOPHICAL MAGAZINE
Volume 96, Issue 27, Pages 2868-2886
Publisher
Informa UK Limited
Online
2016-08-05
DOI
10.1080/14786435.2016.1217360

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