Study of heat transfer performance of miniature heat sink for integrated circuit packaging field
Published 2023 View Full Article
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Title
Study of heat transfer performance of miniature heat sink for integrated circuit packaging field
Authors
Keywords
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Journal
Case Studies in Thermal Engineering
Volume 49, Issue -, Pages 103290
Publisher
Elsevier BV
Online
2023-07-13
DOI
10.1016/j.csite.2023.103290
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