Study of heat transfer performance of miniature heat sink for integrated circuit packaging field

Title
Study of heat transfer performance of miniature heat sink for integrated circuit packaging field
Authors
Keywords
-
Journal
Case Studies in Thermal Engineering
Volume 49, Issue -, Pages 103290
Publisher
Elsevier BV
Online
2023-07-13
DOI
10.1016/j.csite.2023.103290

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