Multi-scan cyclic voltammetry to roughen the surface of copper foil for application in copper-clad laminates

Improvement of performance stability of electrolytic copper foils by bi-component additives

(2022) Yue Sun et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates

(2022) Ni Wang et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

High-Speed Interconnects: History, Evolution, and the Road Ahead

(2022) Vijay Rao Kumbhare et al.   IEEE MICROWAVE MAGAZINE

Hydrothermally etching commercial carbon cloth to form a porous structure for flexible zinc-ion hybrid supercapacitors

(2022) Mingliang Xiang et al.   APPLIED SURFACE SCIENCE

Ultimate response time in mid-infrared high-speed low-noise quantum cascade detectors

(2021) Tatsuo Dougakiuchi et al.   APPLIED PHYSICS LETTERS

Bionic chitosan-carbon imprinted aerogel for high selective recovery of Gd(Ⅲ) from end-of-life rare earth productions

(2020) Yuzhe Zhang et al.   JOURNAL OF HAZARDOUS MATERIALS

Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz

(2019) Isabella Lau et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface

(2019) Zhidan Zhu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Review of Power Electronics Components at Cryogenic Temperatures

(2019) Handong Gui et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness

(2017) Po-Fan Chan et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Facile Fabrication of a Superhydrophobic Cu Surface via a Selective Etching of High-Energy Facets

(2012) Lijun Liu et al.   Journal of Physical Chemistry C

Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards

(2011) Amendra Koul et al.   IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY