SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness

Title
SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness
Authors
Keywords
-
Journal
MATERIALS AND MANUFACTURING PROCESSES
Volume -, Issue -, Pages 1-10
Publisher
Informa UK Limited
Online
2023-09-06
DOI
10.1080/10426914.2023.2254366

Ask authors/readers for more resources

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now