SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness
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Title
SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness
Authors
Keywords
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Journal
MATERIALS AND MANUFACTURING PROCESSES
Volume -, Issue -, Pages 1-10
Publisher
Informa UK Limited
Online
2023-09-06
DOI
10.1080/10426914.2023.2254366
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