A Non-contact Method for Estimating Thin Metal Film Adhesion Strength through Current Induced Void Growth

Published 2023 View Full Article

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Title
A Non-contact Method for Estimating Thin Metal Film Adhesion Strength through Current Induced Void Growth
Authors
Keywords
-
Journal
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
Volume -, Issue -, Pages 1-37
Publisher
ASME International
Online
2023-11-01
DOI
10.1115/1.4063948

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