4.5 Article

A systematic printability study of direct ink writing towards high-resolution rapid manufacturing

Journal

Publisher

IOP Publishing Ltd
DOI: 10.1088/2631-7990/acd090

Keywords

direct ink writing; extrusion mechanism modelling; computational fluid dynamic (CFD); printability process parameters; high-resolution printing

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Direct ink writing (DIW) is a promising technique for fabricating multiscale and multi-functional architectures. This study focuses on the impact of ink rheology and processing parameters on the printability and quality of DIW. Through modeling and experiments, the optimal process parameters were determined, leading to the successful fabrication of high-resolution microstructures and circuit systems.
Direct ink writing (DIW) holds enormous potential in fabricating multiscale and multi-functional architectures by virtue of its wide range of printable materials, simple operation, and ease of rapid prototyping. Although it is well known that ink rheology and processing parameters have a direct impact on the resolution and shape of the printed objects, the underlying mechanisms of these key factors on the printability and quality of DIW technique remain poorly understood. To tackle this issue, we systematically analyzed the printability and quality through extrusion mechanism modeling and experimental validating. Hybrid non-Newtonian fluid inks were first prepared, and their rheological properties were measured. Then, finite element analysis of the whole DIW process was conducted to reveal the flow dynamics of these inks. The obtained optimal process parameters (ink rheology, applied pressure, printing speed, etc) were also validated by experiments where high-resolution (mu m) patterns were fabricated rapidly (>70 mm s(-1)). Finally, as a process research demonstration, we printed a series of microstructures and circuit systems with hybrid inks and silver inks, showing the suitability of the printable process parameters. This study provides a strong quantitative illustration of the use of DIW for the high-speed preparation of high-resolution, high-precision samples.

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